LED TECHNOLOGY VARIANTS
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SMD: Stands for "Surface Mount Device". This is the most common design where the LEDs are soldered directly onto the PCB.
COB: Stands for "Chip on Board" and is a new manufacturing process that allows a higher density of pixels per unit area with improved performance.
GOB/COS: A production method in which the SMD LED diodes in the module are provided with a coated surface on the front side.
4in1: 4 RGB LED pixels combined in one SMD package
DIP: Standard LEDs for low resolution and high brightness - mainly used for outdoor LED walls.